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This product complies with the RoHS Directive (EU 2002/95/EC).
DMA206E1
Silicon PNP epitaxial planar type
For high-frequency amplification Features Package
Code Mini6-G4-B Name Pin 1: Emitter (Tr1) 2: Emitter (Tr2) 3: Base (Tr2)
High transition frequency fT Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package
Basic Part Number
Dual DSA2G01 (Individual)
4: Collector (Tr2) 5: Base (Tr1) 6: Collector (Tr1)
Packaging
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Marking Symbol: C9 Internal Connection
Unit V V V mA mW C C
(C1) 6 (B1) 5 (C2) 4
Tr2
Absolute Maximum Ratings Ta = 25C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC PT Tj Tstg Rating -30 -20 -5 -30 300 150 -55 to +150
Tr1
1 (E1)
2 (E2)
3 (B2)
Electrical Characteristics Ta = 25C3C
Parameter Base-emitter voltage Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio hFE ratio * Collector-emitter saturation voltage Transition frequency Reverse transfer capacitance (Common emitter) Noise figure Reverse transfer impedance Symbol VBE ICBO ICEO IEBO hFE hFE (Small/Large) VCE(sat) fT Cre NF Zrb Conditions VCE = -10 V, IC = -1 mA VCB = -10 V, IE = 0 VCE = -20 V, IB = 0 VEB = -5 V, IC = 0 VCE = -10 V, IC = -1 mA VCE = -10 V, IC = -1 mA IC = -10 mA, IB = -1 mA VCE = -10 V, IC = -1 mA VCE = -10 V, IC = -1 mA, f = 10.7 MHz VCE = -10 V, IC = -1 mA, f = 5 MHz VCE = -10 V, IC = -1 mA, f = 2 MHz 150 70 0.50 0.99 - 0.1 300 1.0 2.8 22 Min Typ - 0.7 - 0.1 -100 -10 220 Max Unit V A A A V MHz pF dB W
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Ratio between 2 elements
Publication date: September 2010
Ver. AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DMA206E1
DMA206E1_PT-Ta DMA206E1_IC-VCE DMA206E1_hFE-IC
PT Ta
400 -50 Ta = 25C
IC VCE
250
hFE IC
VCE = -10 V 200 Ta = 85C
Total power dissipation PT (mW)
300
Collector current IC (mA)
-40 IB = -500 A -450 A -400 A -350 A -300 A -250 A -200 A -150 A -10 -100 A -50 A
-30
Forward current transfer ratio hFE
150
200
25C -30C
-20
100
100
50
0
0
40
80
120
160
200
0
0
-2
-4
-6
-8
-10
-12
0 -1
-10
-102
Ambient temperature Ta (C)
DMA206E1_VCEsat-IC
Collector-emitter voltage VCE (V)
DMA206E1_IC-VBE
Collector current IC (mA)
DMA206E1_Cob-VCB
VCE(sat) IC
Collector-emitter saturation voltage VCE(sat) (V)
-10 IC / IB = 10 -40 VCE = 10 V
IC VBE
Collector output capacitance (Common base, input open circuited) Cob (pF)
4.0
Cob VCB
IE = 0 f =1 MHz Ta = 25C
Collector current IC (mA)
-30 Ta = 85C -20
25C
-1
-30C
3.0
-10-1
Ta = 85C -30C 25C
2.0
-10
1.0
-10-2 -10-1
-1
-10
-102
0
0
- 0.4
- 0.8
-1.2
0 -1
-10
-102
Collector current IC (mA)
DMA206E1_fT-IC
Base-emitter voltage VBE (V)
Collector-base voltage VCB (V)
fT IC
350 300 250 200 150 100 50 0 -10-1 VCE = -10 V Ta = 25C
Transition frequency fT (MHz)
-1
-10
-102
Collector current IC (mA)
2
Ver. AED
This product complies with the RoHS Directive (EU 2002/95/EC).
DMA206E1
Mini6-G4-B
Unit: mm
2.90 -0.05
+0.20
0.50 -0.05
+0.10 +0.10
0.30 -0.05
0.13 -0.02
+0.05
6
5
4
1.50 -0.05
+0.25
2.8 -0.3
+0.2
1
2 (0.95)
3 (0.65) (0.95)
1.9 0.1
8
1.1 -0.1
+0.2
0 to 0.1
1.1 -0.1
+0.3
0.4 0.2
6
Ver. AED
3
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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